sic schottky diode semelab ltd reserves the right to change test condi tions, parameter limits and package dimensions with out notice. information furnished by semelab is believed to be both accurate and reliable at the time of going to press. however semelab assumes no responsibility for any errors or omissions discovered in its use. semelab encourage s customers to verify that datasheets are current before placing a n order. semelab ltd semelab ltd semelab ltd semelab ltd coventry road, lutterworth, leicestershire, le17 4 jb document number 9166 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 1 of 6 sml05sc06d3a / SML05SC06D3B v r(max) = 600v i f(avg) = 5a v f(typ ) = 1.5v dlcc3 hermetic ceramic surface mount package designed as a drop in replacement for ?d-5b?/ ?e-melf? package ? no reverse recovery no forward recovery high reliability screening options available absolute maximum ratings (t a = 25c unless otherwise stated) v rrm peak repetitive reverse voltage 600v v rsm surge peak reverse voltage 600v i f(avg) average forward current (1) 5a i fsm non-repetitive peak forward surge current (3,4) 60a p d total power dissipation at t a = 25c 2.96 (2) derate above t a = 25c 14.8mw/c (2) t j junction temperature range -55 to +225c t stg storage temperature range -55 to +225c thermal properties symbols parameters max. units r jsp(in) thermal resistance, junction to solder pads t sp = 25c 29 c/w r ja (pcb) (2) thermal resistance, junction to ambient, on pcb 67.5 c/w r ja (pcb) (3) thermal resistance, junction to ambient, on pcb 123 c/w notes notes notes notes (1) i o1 is rated at 1.75a @ t a = 25 c for pc boards where thermal resistance from mount ing point to ambient is sufficiently controlled whe re t j (max) does not exceed 175 c; this equates to r ja(pcb) 68c/w. (2) pcb = fr4, 0.0625 inch (1.59mm) thick, single layer , 1.0-oz cu, pad size, (1.0? x 1.0?), (25.4mm x 25. 4mm) , horizontal in still air. (3) pcb = fr4, 0.0625 inch (1.59mm) thick, single layer , 1.0-oz cu, pad size, (0.070? x 0.155?)?, (1.78mm x 3.94mm) ?, horizontal in still air. i o1 is rated at 1.0a @ t a = 25 c for pc boards where r ja(pcb) 125c/w. derate at 7.33ma/c above t a = 25 c in this case. (4) mil-std-750 method 4066.4 condition a1. i o = 1a, v rwm = 600v, v rsm = 600v, ten surges of 8.3ms each at 1 minute interv als, t a = 25c. ? recommended solder pad layout dimensions for this device, as detailed within this datasheet for the d-5a device.
sic schottky diode sml05sc06d3a / SML05SC06D3B semelab ltd semelab ltd semelab ltd semelab ltd coventry road, lutterworth, leicestershire, le17 4 jb document number 9166 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 2 of 6 electrical characteristics (t a = 25c unless otherwise stated) symbol parameters test conditions min. typ. max. unit i f = 5a t j = 25c 1.5 1.8 v f (1) diode forward voltage i f = 5a t j = 175c 2.0 2.4 v v r = 600v t j = 25c 50 200 i r leakage current v r = 600v t j = 175c 100 1000 a dynamic characteristics v r = 600v i f = 5a q c total capacitive charge d i /d t = 500a/ m s t j = 25c 28 nc v r = 0v t j = 25c 550 v r = 200v t j = 25c 65 c t junction capacitance (f = 1.0mhz) v r = 400v t j = 25c 50 pf notes notes notes notes (1) pulse width 300us, 2%
sic schottky diode sml05sc06d3a / SML05SC06D3B semelab ltd semelab ltd semelab ltd semelab ltd coventry road, lutterworth, leicestershire, le17 4 jb document number 9166 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 3 of 6 typical performance over temperature range the forward characteristics of 600v d3a diodes 0.0 2.0 4.0 6.0 8.0 10.0 12.0 0 0.5 1 1.5 2 2.5 v f - for wa r d v ol t a ge ( v ) if - forward current (a) -55 25 100 125 150 175 225 reverse leakage characteristics of 600v d3a diodes 000.0e+0 2.0e-6 4.0e-6 6.0e-6 8.0e-6 10.0e-6 12.0e-6 14.0e-6 16.0e-6 18.0e-6 0 100 200 300 400 500 600 700 800 v r r e v e r s e v ol t a ge ( v ol t s ) reverse current (a) -55 25 100 125 150 175 225
sic schottky diode sml05sc06d3a / SML05SC06D3B semelab ltd semelab ltd semelab ltd semelab ltd coventry road, lutterworth, leicestershire, le17 4 jb document number 9166 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 4 of 6 sml05sc06d3 equivalent reverse recovery time device i f =500ma, i r = 1a, i rr =250ma -1.500 -1.000 -0.500 0.000 0.500 1.000 -1 8 -1 6 -1 4 -1 2 -1 0 -8 -6 -4 -2 02 4 6 8 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 2 6 2 8 3 0 3 2 3 4 time (ns) c u rre n t(a ) -55c 0c 25c 50c 100c 150c 200c 225c sic schottky diode, no minority carrier recombination thus zero reverse recovery. recovery time show n is due to a small junction capacitance charge and is independent of junction temperature
sic schottky diode sml05sc06d3a / SML05SC06D3B semelab ltd semelab ltd semelab ltd semelab ltd coventry road, lutterworth, leicestershire, le17 4 jb document number 9166 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 5 of 6 mechanical data a d c c b 1 2 sml d3a a d c c b 1 2 3 sml d3b * the additional contact provides a connection to t he lid in the application. connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; see the space weather link www.semelab.co.uk/dlcc3.html on the semelab web site. package variant to be specified at order. ? the dlcc3 package design takes full advantage of t he proven high reliability pedigree of the htcc sur face mount packaging technology, which is easily integrated for automated assembly. semelab has taken the existing standards for ceram ic surface mount package manufacture and added additional design features to enhance the rmal performance, to present a competitive alternat ive for high reliability applications. solder pad layout a b c soldering temperature should be 260c for a maximum of 10 seconds. the physical dimensions for the dlcc3 ceramic packa ge are designed to be different from the published dimensions for t he ?d-5b? and ?e- melf? outlines. the dlcc3 design fully utilises th e recommended solder footprint for the ?d-5b? / ?e-melf? package, and as such presents a drop in replacement for existing board d esigns. package mass gold plated solder pad finish = 150mg mm inches a 7.32 0.288 b 1.78 0.070 c 3.94 0.155 dlcc3 variant b (d3 b ) pad 1 anode pad 2 cathode pad 3 lid contact to cathode* dimension mm inches a 7.00 0.10 0.275 0.004 b 3.75 0.10 0.143 0.004 c 1.60 0.10 0.063 0.004 d 1.76 0.10 0.069 0.004 dlcc3 variant a (d3a) pad 1 anode pad 2 cathode dimension mm inches a 7.00 0.10 0.275 0.004 b 3.75 0.10 0.143 0.004 c 1.60 0.10 0.063 0.004 d 1.76 0.10 0.069 0.004
sic schottky diode sml05sc06d3a / SML05SC06D3B semelab limited semelab limited semelab limited semelab limited coventry road, lutterworth, leicestershire, le17 4 jb telephone +44 (0) 1455 556565 fax +44 (0) 1455 5526 12 email: sales@semelab-tt.com website: http://www.semelab-tt.com document number 9166 issue 2 page 6 of 6 screening options space level (jqrs/esa) and high reliability options a re available in accordance with the high reliability and screening options handbook available for download from the from the tt electronics semelab web site. esa quality level products are based on the testing procedures specified in the generic escc 5000 and in the corresponding part detail specifications. semelab?s qr216 and qr217 processing specifications (jqrs), in conjunction with the companies iso 9001: 2000 approval present a viable alternative to the america n mil- prf-19500 space level processing. qr217 (space level quality conformance) is based on the quality conformance inspection requirements of mil- prf- 19500 groups a (table v), b (table via), c (table vi i) and also esa / escc 5000 (chart f4) lot validation tests. qr216 (space level screening) is based on the scree ning requirements of mil-prf-19500 (table iv) and also e sa /escc 5000 (chart f3). jqrs parts are processed to the device data sheet a nd screened to qr216 with conformance testing to q217 groups a and b in accordance with mil-std-750 method s and procedures. additional conformance options are available, for ex ample pre-cap visual inspection, buy-off visit or data pac ks. these are chargeable and must be specified at the o rder stage (see ordering information). minimum order quantities may apply. alternative or additional customer specific conforma nce or screening requirements would be considered. contact semelab sales with enquires. marking details parts can be laser marked with approximately 7 char acters on two lines and always includes cathode identifica tion. typical marking would include part or specification number, week of seal or serial number subject to available space and legibility. customer specific marking requirements can be arrang ed at the time of order. example marking: ordering information part numbers are built up from type, package varian t, and screening level. the part numbers are extended to i nclude the additional options as shown below. type ? see electrical stability characteristics tab le package variant ? see mechanical data screening level ? see screening options (esa / jqrs) additional options: customer pre-cap visual inspection .cvp customer buy-off visit .cvb data pack .da solderability samples .ss scanning electron microscopy .sem radiography (x-ray) .xray total dose radiation test .rad mil-prf-19500 (qr217) group b charge .grpb group b destructive mechanical samples .gbdm (12 pi eces) group c charge .grpc group c destructive electrical samples .gcde (12 pi eces) group c destructive mechanical samples .gcdm (6 pie ces) esa/escc lot validation testing (subgroup 1) charge .lvt1 lvt1 destructive samples (environmental) .l1de (15 pieces) lvt1 destructive samples (mechanical) .l1dm (15 pie ces) lot validation testing (subgroup 2) charge .lvt2 lvt2 endurance samples (electrical) .l2d (15 pieces ) lot validation testing (subgroup 3) charge .lvt3 lvt3 destructive samples (mechanical) .l3d (5 piece s) additional option notes: 1) all ?additional options? are chargeable and must b e specified at order stage. 2) when group b,c or lvt is required, additional ele ctrical and mechanical destructive samples must be ordered 3) all destructive samples are marked the same as ot her production parts unless otherwise requested. example ordering information: the following example is for the sml05sc06d3a / SML05SC06D3B part with package variant b, jqrs screening, additional group c conformance testing an d a data pack. part numbers: SML05SC06D3B-jqrs (include quantity for flight parts) SML05SC06D3B.grpc (chargeable conformance option) SML05SC06D3B.gcde (charge for destructive parts) SML05SC06D3B.gcdm (charge for destructive parts) SML05SC06D3B.da (charge for data pack) customers with any specific requirements (e.g. marki ng or screening) may be supplied with a similar alternati ve part number (there is maximum 20 character limit to part numbers). contact semelab sales with enquiries. high reliability and screening options handbook link : http://www.semelab.co.uk/pdf/misc/documents/hirel_ and_screening_options.pdf
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